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Abstract Metal halide perovskites show promise for next-generation light-emitting diodes, particularly in the near-infrared range, where they outperform organic and quantum-dot counterparts. However, they still fall short of costly III-V semiconductor devices, which achieve external quantum efficiencies above 30% with high brightness. Among several factors, controlling grain growth and nanoscale morphology is crucial for further enhancing device performance. This study presents a grain engineering methodology that combines solvent engineering and heterostructure construction to improve light outcoupling efficiency and defect passivation. Solvent engineering enables precise control over grain size and distribution, increasing light outcoupling to ~40%. Constructing 2D/3D heterostructures with a conjugated cation reduces defect densities and accelerates radiative recombination. The resulting near-infrared perovskite light-emitting diodes achieve a peak external quantum efficiency of 31.4% and demonstrate a maximum brightness of 929 W sr⁻¹m⁻². These findings indicate that perovskite light-emitting diodes have potential as cost-effective, high-performance near-infrared light sources for practical applications. 

Abstract Mechanoresponsive polymeric materials that respond to mechanical deformation are highly valued for their potential in sensors, degradation studies, and optoelectronics. However, direct visualization and detection of these responses remain significant obstacles. In this study, novel mechanoresponsive polybiidenedionediyl (PBIT) derivative topochemical polymers are developed that depolymerize under mechanical forces, exhibiting a distinct and irreversible color change in response to grinding, milling, and compression. This color change is attributed to the alteration of polymer backbone conjugation during elongated Carbon‐Carbon (C─C) single bond cleavage. Quantum chemical pulling simulations on PBIT polymers reveals a force range of 4.3–5.0 nN associated with the selective cleavage of elongated C─C single bonds. This force range is comparable to that observed for typical homolytic mechanophores, supporting the mechanistic interpretation of homolytic bond scission under mechanical stress. C─C bond cleavage kinetic studies of PBIT under compression indicates that strong interchain interactions significantly increase the pressure needed to cleave the elongated C─C bonds. Additionally, PBIT polymer thin films are composited with polydimethylsiloxane to create free‐standing and robust thin films, which can serve as ink‐free and rewritable paper for writing and stress visualization applications. This advancement opens new possibilities for utilizing crystalline and brittle topochemical polymers in practical applications.